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U6807B
Hex-Driver for High Temperature Application
Description
The hexdriver IC includes 6 non-inverted and current limited output stages with an open collector. Each output can sink 20 mA, parallel output operation is possible. The digital inputs have Schmitt-trigger function with pull-up current sources to 5 V.
Features
D Six input comparators with Schmitt-trigger
characteristic
D Output stages:
- Short circuit protected with diode - Load-dump protected @ 1 kW - No crosstalk on adjacent channels - Clamping current @ - 2 mA - Jump start possible
D Input clamping current capability to mA D Integrated protection cells (EMC, ESD, RF)
dedicated to all input stages
"10
D Low voltage reset with hysteresis D ESD protection to human body model:
"2000 V (C = 100 pF, R = 1.5 kW)
Extended Type Number U6807B-FP
Package SO14
Remarks
Block Diagram
VO1 1 VO2 VO3 2 3 VO4 VO5 5 6 VO6 7
4 Under voltage detection VS=5 V 14 VI1 13 VI2 12 VI3 10 VI4 9 VI5 8 VI6
13340
GND
VS
11
VS
Figure 1.
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U6807B
Pin Description
VO1 1 VO2 2 VO3 3 GND 4 VO4 5 VO5 6 VO6 7
13335
14 VI1 13 VI2 12 VI3 11 VS 10 VI4 9 8 VI5 VI6
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Symbol VO1 VO2 VO3 GND VO4 VO5 VO6 VI6 VI5 VI4 VS VI3 VI2 VI1
Function Output 1 Output 2 Output 3 Ground Output 4 Output 5 Output 6 Input 6 Input 5 Input 4 Supply voltage, 5 V Input 3 Input 2 Input 1
Figure 2. Pinning
Basic Circuitry
The integrated circuit, U6805B, requires a stabilized supply voltage (VS = 5 V"5%) to comply with its electrical characteristics. An external buffer capacitor of C = 100 nF value is recommended. An integrated 14-V Z-diode between VS and ground protects the supply pin. All input stages are provided with an integrated 250 kW pull-up resistor and can be directly connected to a microcontroller. All output stages are open collectors each capable of sinking 20 mA. Recommended external components: Pull-up resistor, R = 1 kW Capacitor to GND, C = 470 pF, see figure 3
Current Limitation of the Output Stages
A temperature dependent current limitation between 25 mA and 100 mA protects the stages during a short. An appropriate heat sink assembly with RthJA < 100 K/W and/or a further reduction of the maximum ambient temperature is recommended in order to avoid thermal overstress. Depending on the numbers of output stages which may be in short circuit condition these maximum ratings are (with RthJA < 120 K/W): Tamb max 80C @ 2 channels shorted simultaneously Tamb max 65C @ 3 channels shorted simultaneously Refer to hexdriver U6805B if thermal shut down is required.
x x
Functional Description
General ON state: Low level at the input stage activates the corresponding output stage. OFF state: The internal pull-up resistor gives high level to the input comparator and deactivates the output stage. 7 V Z-diodes between each input pin and GND are capable of mA clamping currents without crosstalk on adjacent input stages.
Transients and Load-Dump
An integrated 28-V Z-diode protects each output stage against transients and load-dump (Schaffner pulses). With the help of external 1-kW resistor , the output transistor is capable of the corresponding current which flows during each of these conditions. Apart from that, outputs are short circuit and overload protected.
"10
Low Voltage Detection
When supply voltage is switched on, a power-on reset pulse is generated internally, which disables all output stages until a defined supply voltage level is reached. The low voltage detection is provided with a hysteresis of Vhyst = 0.5 V typically.
A total clamping current of mA should be observed with respect to the power dissipation.
"30
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Absolute Maximum Ratings
Parameters Supply voltage Ambient temperature range * Storage temperature range Maximum junction temperature * Symbol VS Tamb Tstg Tj Value 7.0 -40 to +125 -50 to +150 +150 Unit V
_C _C _C
To be reduced if 2 or 3 output stages are shorted sumultaneously (see "remark" on page 2).
Thermal Resistance
Parameters Junction ambient Symbol RthJA Value 120 Unit K/W
Electrical Characteristics
VS = 5 V"5%, Tamb = 25_C, reference point pin 4 (GND), unless otherwise specified, see figures 1 and 3. Parameters Supply Supply voltage Supply current Low voltage detection threshold Low voltage hysteresis Inputs Pins 8, 9, 10, 12, 13 and 14 VI II RI OFF ON Pins 1, 2, 3, 5, 6 and 7 VO ILeak VSat Ilimit td 25 5 26.5 5 2.5 0.7 V pF V mA VI VI Vhyst 170 250 3.3 1.8 1.5 6.7 Inputs open Inputs closed to GND ON OFF Pin 11 VS IS IS VTH(ON) VTH(OFF) Vhyst 4.75 0.8 7 3.7 3.0 0.55 5.25 4.2 14.5 4.6 3.8 1.05 V mA mA V V V Test Conditions / Pins Symbol Min. Typ. Max. Unit
Z-diode protection voltage Z-diode clamping current Pull-up resistor Switching threshold Hysteresis Outputs Integrated capacitor Leakage current Saturation voltage (I = 20 mA) Current limitation Propagation delay (470 pF, 1 kW, 20 V)
"10
305
8.5
V mA kW V V V
Z-diode protection voltage
mA ms
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U6807B
Application Circuit
VS=5 V 100 nF VI1 VI2 VI3 Micro controller VI4 VI5 VI6 VO1 VO2 VO3 VO4 VO5 VO6 C C C C C C 6x 470 pF
13341
VBatt Load R R R R R R 6x 1k
U6807B
Hexdriver IC
Figure 3. Application schematic
Package Information
Package SO14
Dimensions in mm
5.2 4.8 8.75 3.7
1.4 0.4 1.27 7.62 14 8 0.25 0.10 0.2 3.8 6.15 5.85
technical drawings according to DIN specifications 13035
14
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Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
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